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Department or Institution involved

Directed self-assembly of block co-polymers for nanoelectronics and nanomechanics

Topic description
The future progress in miniaturization of semiconductor electronics faces many challenges, while, at the same time, there is an increasing need for more powerful and energy efficient data processing systems. Internet of things (IOT) deserves billions of tiny computers that can sense and communicate from anywhere. It is expected that there will be nearly 26 billion devices connected to the IoT by 2020. Therefore, advanced computation and communication must be delivered at extremely low power consumption. This will only be possible with the combination of smaller, traditional CMOS devices in combination with beyond CMOS devices at the edge of the technological capabilities.

The projects for this topic should address the extension of present state-of-the art in the integration of non-CMOS devices into CMOS circuits by generating new manufacturability methods and nanodevice concepts.  Manufacturability issues must be fully addressed. The fabrication technology should be based on the use of directed self-assembly methods (DSA) of block copolymers, as it combines high resolution (< 10 nm half pitch) and high throughput, together with more simplicity and lower cost in comparison with extreme UV optical lithography. It is expected that the project will have an impact in nanoelectronics R&D by providing, novel, affordable, high throughput and robust fabrication methods and new industrialization routes

Project supervisor & hosting group
Prof. Francesc Perez-Murano. NANONEMS group. IMB-CNM, CSIC.

The NEMS and Nanofabrication group is part of the Institute of Microelectronics of Barcelona (IMB-CNM, CSIC). The group was formed in 2001 to trigger the activities on Nanotechnology research at IMB-CNM.  Since its origin, the main activities of the group have been focused on developing nanofabrication methods and on nanoelectromechanical systems. During this period, close to 100 publications has been realized in top journals such as Science, Physical Review Letters, Nature Nanotechnology, Nano Letters and Small, among others. Also, the group has been involved in numerous European (>15) and National projects, including the coordination of one European Project and the coordination of one project of the Spanish strategic action on Nanotechnology. The group is very active on the formation of PhD students, which are later completing their training in high-level institution like Caltech, UCLA, EPFL or UC-Berkeley. The group makes an extensive and intensive use of the Clean Room facilities at the IMB- CNM. It is the largest Clean Room (1,500 m2) in Spain devoted to micro and nanofabrication. It holds a full range of equipment for nanolithography (EBL, FIB, Nanoimprint, etc.).

The scientific goal of the group is the investigation, study and exploitation of electronic and electromechanical properties that arise in solid-state artificial structures by the fact that their significant dimensions are in the nanometer scale. Research on advanced nanofabrication methods is an essential part of the activities, together with the search of novel approaches for characterization.  The aim is to investigate on novel properties and methods that will present potential for being applied in devices and systems in order to add new functionalities and enhanced performances.

Candidate’s profile  
To be regarded as an eligible applicant, the candidate should have:
•    PhD in one of the following areas;  Physics, Chemistry, Chemical Engineering, Materials Science/Engineering, Electronic Engineering, Nanoscience and Nanotechnology
•    Competences in: Nanofabrication methods, Physical characterization methods at the nanoscale. Experience in Clean Room operation
•    Proficiency in both written and spoken English is necessary.

If you are an eligible candidate interested in applying, please do contact to get you in contact with the Hosting Group.

Department or Institution involved

Research on Advanced Power Packaging Techniques

Topic description
The objective of the project that will host the fellow aims at providing new and advanced solutions for packaging semiconductor power devices. Nowadays, the development of wide band-gap semiconductors (SiC, GaN and Diamond) provides advanced power devices with high-speed switching capabilities, high-temperature capability, high-voltage ratings and, in general, high-power densities. These capabilities are usually limited by the package (the “interface” between the die and the electronic circuit) and not by the device itself. For this reason, new assembly techniques, materials, topologies, etc. are of main interest for reaching the maximum operation performances provided by wide band-gap semiconductors.

The Fellow will develop his work mainly on the following areas:

-    packaging solutions allowing high-speed switching (interconnections) and high-temperature capability (materials)
-    thermal management (cooling strategies and thermal characterization)
-    electrical and thermo-mechanical reliability.

Project supervisor & hosting group
Dr. Xavier Jordà will supervise the Fellow. He is full time senior researcher at IMB-CNM-CSIC in Barcelona, Head of the Power Devices and Systems group. This group started its research activity 30 years ago on the development of semiconductor power devices (VDMOS, IGBT, etc.). On 2000 the group extended these activities towards the Power Systems Integration and Reliability (PSIR) field, in particular working on the development of advanced electro-thermal characterization techniques, on new packaging solutions suitable for high-power and high-temperature power devices, and on the study of their failure and reliability mechanisms. This research line has participated in more than 10 Spanish projects, 5 EU projects and more than 10 industrial contracts, and their researchers have published more than 50 papers. The Power Devices and Systems Group involve 22 people while the PSIR team consists of 3 senior researchers, 3 PhD students and a support engineer. The group mainly works on the following research areas:

-    Silicon Power Devices
-    Wide Band Gap Semiconductor Devices
-    Power Systems Integration & Reliability

The projects under development related with the proposed subject include two EU funded projects, one from the ECSEL JU (PowerBase) and a second one from the H2020 LCE call (GreenDiamond), and a Spanish national project (SmartCells). These projects cover the characterization and modelling of wide band-gap power semiconductor devices (GaN, diamond, SiC), the development of packaging techniques suitable for high-temperature and high-speed switching and the integration of control and monitoring circuitry with the power devices in the same package (intelligent power modules).

Candidate’s profile  
•    To be regarded as an eligible applicant, the candidate should have:
    PhD in Electronics or Mechanical Engineering or Physics;
•    Knowledge and experience in most of the following:
•    Packaging of Semiconductor devices
•    Power  devices and systems
•    Electrical and Thermal characterisation of devices.
Proficiency in both written and spoken English is necessary.

If you are an eligible candidate interested in applying, please do contact to get you in contact with the Hosting Group.

Department or Institution involved

Modeling and simulation of electronic devices based on graphene and related material

Topic description
The research proposal is aligned with the european Graphene Flagship project, where UAB is leading both modeling and simulation activities of graphene and related materials (GRM) based devices in the work-package devoted to Electronic Devices. The Fellow is encouraged to significantly contribute to the development of a Computer Aided Design (CAD) tool to simulate GRM-based circuits and look into new circuits exploiting the peculiar properties of 2D materials targeting digital and High-Frequency applications. For such a purpose, we face many challenging issues. A central one is the modeling of the metal-GRM junction. Existing models of electrical contacts are often inapplicable at the nanoscale because there are significant differences between nanostructures and bulk materials arising from unique geometries and electrostatics. As a consequence, an appropriate model for carrier transport from a 3D metal to a 2D GRM sheet, with different density of states and work functions, is needed. Moreover, inclusion of non-idealities like surface states or the presence of an unintentional oxide layer should be included in any realistic model. Other relevant issue concerns the RF behavior of GRM based transistors for frequencies around the cut-off frequency, where accounting for non-quasi static effects is necessary. On the other hand, investigation of how electrical noise is impacting on the transistor performance is a prerequisite for this technology to succeed. A final topic is the definition of a strategy to enhance GRM based transistor performance via downscaling. This is related with the study of the short-channel effects, which are of central importance.  

Project supervisor & hosting group
Dr. David Jiménez

The hosting group is widely recognized for its activities in the area of modelling and simulation of electronic devices based on graphene and related materials.

The main relevant project associated with this area is:
Graphene-Based Disruptive Technologies (GRAPHENE CORE 1)
Grant agreement n° 696656 GrapheneCore1
Duration: since 1th april 2016 to 31th march 2018    
PI: D. Jiménez

Planned secondments
The hosting group has relevant collaborations with several partners of the Graphene Flagship project. Of special relevance are the collaborations with Chalmers University and AMO GmbH. The former collaboration is seeking to bridge the gap between graphene device physics and radio-frequency circuit design and the latter is pursuing the development of heterostructures based on GRMs. The Fellow is encouraged to be on secondments to these institutions in order to strengthen those collaborations.

Candidate’s profile  
A PhD in electronics / telecommunication engineering or physics

Specific abilities and skills:
Expertise in the development of computational methods
Expertise in graphene and related materials for electronics
Expertise in microelectronic circuit design techniques

If you are an eligible candidate interested in applying, please do contact to get you in contact with the Hosting Group.